ACM Research, Inc. announced the receipt of an evaluation tool order for its Ultra ECP map copper plating tool from a major IC manufacturer. The order specifies a delivery in early 2022 and is subject to technical qualification and other commercial terms. ACM?s Ultra ECP map builds on ACM?s proven electro-chemical-plating (ECP) technology. The tool is configured with ACM?s Multi-Anode Partial Plating function, which allows the deposition of the copper metal layer on a dual-damascene structure for its advanced technology nodes. The tool is designed to be compatible with ultra-thin seed layers and to offer high throughput and uptime with a lower cost of consumables and lower cost of ownership.