BERLIN, Nov 29 (Reuters) - German chipmaker Siltronic said on Sunday it is in advanced takeover talks with Taiwan's GlobalWafers in a 3.75-billion-euro deal ($4.5 billion) to create a leading player in the wafer industry.

Siltronic said in a statement GlobalWafers is expected to bid 125 euros per Siltronic share, which represents an 11% premium over Friday's closing price, and said it considered the offer "attractive and appropriate".

The Munich-based firm said it expected Wacker Chemie , which owns a 30.8% stake in Siltronic, will conclude an agreement to tender its shares at this offer price.

Siltronic said the companies have been in negotiations for several months and expect to sign a binding merger agreement in the second week of December, following approval by both companies' supervisory boards.

Under the current terms of the deal, there will be no site closures or layoffs of employees for operational reasons in Germany until the end of 2024, Siltronic said.

The combined companies would be number two in the world market for 300-millimeter wafers - silicon wafers from which chips are punched - behind Japan's Shin-Etsu GlobalWafers is currently number four, Siltronic number five.

Siltronic also said it expects to propose a dividend of 2 euros per share for its fiscal year 2020 which will be paid prior to the closure of the deal. ($1 = 0.8365 euros) (Reporting by Caroline Copley and Alexander Huebner)