BERLIN, Nov 29 (Reuters) - German chipmaker Siltronic
said on Sunday it is in advanced takeover talks with
Taiwan's GlobalWafers in a 3.75-billion-euro deal
($4.5 billion) to create a leading player in the wafer industry.
Siltronic said in a statement GlobalWafers is expected to
bid 125 euros per Siltronic share, which represents an 11%
premium over Friday's closing price, and said it considered the
offer "attractive and appropriate".
The Munich-based firm said it expected Wacker Chemie
, which owns a 30.8% stake in Siltronic, will conclude
an agreement to tender its shares at this offer price.
Siltronic said the companies have been in negotiations for
several months and expect to sign a binding merger agreement in
the second week of December, following approval by both
companies' supervisory boards.
Under the current terms of the deal, there will be no site
closures or layoffs of employees for operational reasons in
Germany until the end of 2024, Siltronic said.
The combined companies would be number two in the world
market for 300-millimeter wafers - silicon wafers from which
chips are punched - behind Japan's Shin-Etsu
GlobalWafers is currently number four, Siltronic number five.
Siltronic also said it expects to propose a dividend of 2
euros per share for its fiscal year 2020 which will be paid
prior to the closure of the deal.
($1 = 0.8365 euros)
(Reporting by Caroline Copley and Alexander Huebner)