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MarketScreener Homepage  >  Equities  >  Nasdaq  >  Cadence Design Systems, Inc.    CDNS

CADENCE DESIGN SYSTEMS, INC.

(CDNS)
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Cadence Design : Digital and Custom Flows Achieve Certification for TSMC N3 Process

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08/25/2020 | 09:46am EDT

Companies broaden collaboration to continue advancing mobile, AI and hyperscale electronics innovation

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that its digital full flow and custom tool suite has been optimized for TSMC’s 3nm (N3) process technology. The Cadence® tools have achieved the latest Design Rule Manual (DRM) and SPICE certification for TSMC’s N3 process. These innovations assist in driving and delivering next-generation mobile, AI and HPC applications, developed on the N3 process technology, with innovative reference flows and methodologies. Cadence and TSMC continue to work closely with customers on production designs on TSMC’s advanced-process technologies.

The certified tool suites support the Cadence Intelligent System Design strategy, enabling customers to achieve SoC design excellence. Cadence’s integrated digital and custom flow is fully convergent and all tools work together seamlessly. Customers can download the corresponding N3 process design kit (PDK) to begin design projects now. To learn more about the Cadence advanced-node solutions, visit www.cadence.com/go/adnnodesolspr.

N3 Digital and Signoff Tool Suite Certification

The Cadence integrated digital full flow has been updated and certified for use on TSMC’s N3 process technology. The flow features enhanced physical optimization and timing signoff closure. It includes the Innovus Implementation System, Liberate Characterization, Liberate Variety Statistical Characterization, Quantus Extraction Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution and Pegasus Verification System. Additionally, the Genus Synthesis Solution and its predictive iSpatial technology is enabled for these process technologies for mobile, AI and hyperscale designs.

The Cadence digital suite and available reference flows help customers achieve better power, performance and area (PPA) while designing on TSMC’s N3 process. Some of the tool suite enhancements that enable customers to successfully design mobile, AI and HPC systems with improved PPA include, improved extraction accuracy, updated routing rules, accurate LVF-generation during characterization and robust support of advanced coloring.

N3 Custom Tool Suite Certification

The Cadence custom tool suite has been certified on TSMC’s N3 process. The certification includes the Virtuoso® Custom IC design platform, consisting of the Virtuoso Schematic Editor, Virtuoso Layout Suite and Virtuoso ADE Product Suite, the Voltus-Fi Custom Power Integrity Solution, and the Spectre® Circuit Simulation Platform, which includes the Spectre X Simulator.

Cadence has continuously improved its custom design methodologies and capabilities within the Virtuoso Advanced-Node Platform for use with TSMC’s advanced-process technologies. Customers continue to achieve better custom design throughput versus traditional design methodologies using the advanced capabilities within the Virtuoso platform. Custom enhancements for TSMC’s N3 process technology include expanded 3nm design rule support, custom digital color remastering, enhanced analog cell support, additional productivity improvements with an enhanced device-level P&R flow and a front-to-back legacy-node design migration flow.

“By continuing to extend our collaboration with Cadence, we’re providing support for our customers that are designing the next generation of mobile, AI and HPC systems using our latest N3 process,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “Our latest work enables our customers to design with the tools, benefitting from the significant power and performance boost of TSMC’s 3nm process technology and to quickly launch their new product innovations to market.”

“We’ve continued to work closely with TSMC to enable our customers to take advantage of the most advanced technologies required to support today's emerging mobile, AI and HPC applications,” said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital & Signoff Group at Cadence. “Based on latest N3 certification from TSMC and our joint successes with customers on N7 and N5 designs, customers are now evaluating our digital reference flow on TSMC’s N3 process technology to take their designs to the next level.”

About Cadence

Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications including consumer, hyperscale computing, 5G communications, automotive, aerospace, industrial and healthcare. For six years in a row, Fortune Magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2020 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.

© Business Wire 2020

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Financials (USD)
Sales 2020 2 655 M - -
Net income 2020 563 M - -
Net cash 2020 663 M - -
P/E ratio 2020 54,5x
Yield 2020 -
Capitalization 30 507 M 30 507 M -
EV / Sales 2020 11,2x
EV / Sales 2021 10,3x
Nbr of Employees 8 100
Free-Float 83,9%
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Mean consensus OUTPERFORM
Number of Analysts 15
Average target price 119,93 $
Last Close Price 109,37 $
Spread / Highest target 23,4%
Spread / Average Target 9,65%
Spread / Lowest Target -36,0%
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Managers
NameTitle
Lip Bu Tan Chief Executive Officer & Director
Anirudh Devgan President
John B. Shoven Chairman
John M. Wall Chief Financial Officer & Senior Vice President
Neil Kole Chief Information Officer & Senior Vice President
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